Products:

AT-2000 SOJ Lead Conditioner

Fully automatic system straightens leads, aligns pitch, restores planar height and body offset for small outline J-leaded devices

By the very nature of their configuration, J-leaded devices are notoriously difficult to recondition. SOJs require processing that not only restores pitch, lead alignment and coplanarity but also takes into account the intricate curvature of the J-leads themselves. Enter the AT-2000! This system has been designed to meet the demands of both device manufacturers and end users, and in addition to being able to process badly mangled parts, the AT-2000 features:

• Simple, unique single processing station design for maximum throughput
• Ability to process SOJs with 14 - 38 leads (42 optional) on 0.050 inch pitch (1.27 mm)
• Ability to process parts with body thicknesses 0.075 - 0.150 inches (1.90 - 3.81 mm)
• "Dead bug" format prevents lead stress
• Quick change tooling design for fast switching between different device sizes
• Interactive menu programmable computer with easy-to-read vacuum fluorescent display

Operating Sequence

Step 1 - An SOJ device is singulated and a slide assembly restores the perpendicularity of bent out leads; the device then travels "dead bug" on the trackway to the single processing station.

Step 2 - Once in the processing station, two opposing rows of teeth with the exact SOJ lead pitch, travel upwards "combing" through the leads, restoring pin-to-pin spacing. At the upper limit of travel, these combs (which are mounted into a slide assembly) move inwards to fully engage the leads.

Step 3 - With the combs fully engaging the leads and the device held under the upper guide rail from above, the combs oscillate to virtually eliminate any deviations in pin-to-pin spacing and lead sweep.

Step 4 - The upper guide rail insert is machined to the exact standoff of the device J leads. Pressure holding the device in the processing station is reduced and the comb assemblies move from side to side, gently nudging the leads to match the exact height of the guide rail flanges and ensuring that they are perpendicular to the device body. At the outer limits of travel on each side, guide rail pressure is increased to uniformly lower any protruding leads, ensuring that all leads are virtually identical in lead height and curvature.

Step 5 - The conditioned component is released by the processing station, and the next device is singulated.

Options

• Input and output tube shuttles
• Hardware for 42 pin device conditioning

Specifications

General

• Weight: 220 lbs (100 kg)
• Power: Voltage selectable 100/117/124/220/230 VAC, 47 - 440 Hz, 750 W, single phase
• Air: 70 PSI (5 bar) minimum input pressure, clean, oil-free, dry air

Input Capacity

• Devices: Standard 0.300 - 0.400 inches SOJs (changeover required)
• AT-2000 Version
  • Lead count: 14 - 38 leads (42 optional)
  • Lead pitch: 0.050 inches (1.270 mm)
  • Body thickness: 0.075 - 0.150 inches (1.900 - 3.310 mm)
  • J standoff height: +/- 0.005 inches (0.127 mm)
  • Max. lead sweep: 0.025 inches (0.635 mm)
  • Max. lead spread: +/- 0.020 inches (0.500 mm)
  • Max J twist: 0.025 inches (0.635 mm)
• AT-2000 A2 Version
  • Lead count: 16 - 42 leads
  • Lead pitch: 0.050 inches (1.270 mm)
  • Body thickness: 0.075 - 0.150 inches (1.900 - 3.310 mm)
  • J standoff height: +/- 0.005 inches (0.127 mm)
  • Max. lead sweep: 0.025 inches (0.635 mm)
  • Max. lead spread: +/- 0.020 inches (0.500 mm)
  • Max J twist: 0.018 inches (0.457 mm) based on 0.012 inches wide lead

Output Correction Capability

• AT-2000 Version
  • Coplanarity: < 0.002 inches (0.050 mm)
  • Sweep (perpendicular): < 0.005 inches (0.127 mm)
  • Pin-to-pin: +/- 0.003 inches (0.076 mm)
  • Spread (perpendicular): +/- 0.003 inches (0.076 mm)
  • J twist: < 0.007 inches (0.178 mm)
  • Throughput: 1500 UPH (based on average device cycle time)
• AT-2000 A2 Version
  • Coplanarity: < 0.002 inches (0.050 mm)
  • Sweep (perpendicular): < 0.005 inches (0.127 mm)
  • Pin-to-pin: +/- 0.003 inches (0.076 mm)
  • Spread (perpendicular): +/- 0.003 inches (0.076 mm)
  • J twist: < 0.004 inches (0.102 mm)
  • Throughput: 1300 UPH (based on average device cycle time)